At TSMC, We Develop the Technologies that Shape the Future and Change the World Technology is our cornerstone, and Innovation is our passion.
At TSMC, we bring together the most creative minds in science and technology to provide the best foundry services possible, and drive innovation in fields that revolutionize our world and daily lives including high performance computing, mobile, automotive electronics, and the Internet of Things (IoT).
If you want to challenge yourself and unleash innovation with brilliant colleagues located around the world, come join us Responsibilities: Ownership of customer counterparts for TSMC across technology-related quality & reliability issues Early customer engagement for product design requirements for reliability Technology reliability Vmax/rule definition, negotiation, and implementation with the customer, Quality & Reliability, and Research & Development/Operations Coordinate Qual plan and reliability issues with customer & Operations for screen methods & process solutions Be a guardian of TSMC’s reputation for quality, and commitment to deliver defect-free, reliable, and competitive products, accelerating time-to-market of our customers Define DPPM (defective parts per million) requirement for new technology ramp up and DPPM reduction Determine and disseminate “Lessons Learned” to Fabrication Facility stakeholders from both quality, culture, and defense reinforcement perspectives Improve organization capability with technical and analytical problem-solving skills using a structured methodology such as PDCA, 8D, 3Leg/5Why, and KT Communicate and collaborate within internal organizations and engage external customers Qualifications: Masters or Ph.D.
in Electrical Engineering, Physics, Chemistry, Materials, or similar field 15 years of experience in semiconductor quality and reliability, integration, or product engineering Successful track record in fundamental reliability work Expertise in physical intrinsic reliability models such as FEOL (TDDB, BTI, HCI etc.) and M/BEOL (ILD TDDB, EM, SM), reliability failure mechanism, SRAM/Logic product test, product screen methods (DVS/EVS), DPPM projection Expertise in intrinsic reliability physics including device reliability, gate oxide TDDB model and circuit aging simulation Electromigration, stress migration, and M/BEOL TDDB Vmax projection & model Product level Qual xperience such as DVS/EVS, HTOL, Env test, ESD and Latch-up