Essential Duties and Responsibilities:
• Read and interpret assembly instructions, drawings and work instruction processes.
• Set up and run automatic and manual wire bond equipment
• Ability to handle computers in order to fine tune machine programs.
• Written tests for ESD + wirebond and ribbon bond requirements.
• Use tools such as fine tipped tweezers, x-acto knives, vacuum pencils, dental probes, calipers, scales.
• Knowledge of periodic machines certification for bond strengths.
• Inspect and know the difference between an acceptable epoxy placement, die attach assembly, sub attached assembly and wire bond and ribbon bonds on a microelectronic device, in conformance with work instructions, drawings and specifications.
• Inspect – to the drawings/specs and procedures – the devices for defects before starting the assembly and after finishing his/her part of the assembly.
• Adhere to all ESD and other handling requirements.
• Comply with all in-house training as identified in job specific family and or specific training plan.
• Follow company 6S and continuous improvement (kaizen) objectives.
• Perform all other duties, as assigned. Job Knowledge, Skills & Abilities:
• Perform general physical activities.
• Monitor processes, materials and surroundings.
Job Requirements:
• Minimum 2 years working experience as an Auto wirebonder/Auto ribbon bonder in a microelectronic assembly factory.
• Familiar with MIL-PRF-38534 requirements for microelectronics’ assembly.
• Ability to work in a class 100,000 (class 8) clean room environment using clean room antistatic gowns, facemasks, hair covers etc.
• Ability to work with a 30X microscope throughout the day.
• Ability to operate Plasma Cleaners, Auto wirebond, Ribbon bond and Bond Pull machines used for microelectronic devices: K&S1488, Palomar 2460, Palomar 8000, Palomar 9000 – auto wirebonders, Palomar 2470 – auto ribbon bonder and Dage 4000, Dage 2200, Unitek MicroPull III & IV bond pull machines or Equivalent.